Media Summary: This video is for engineers working to overcome This video is for anyone interested in the causes and effects of For years, people have been using gold-tin in

Avoid The Void Voiding In High Temperature Soldering - Detailed Analysis & Overview

This video is for engineers working to overcome This video is for anyone interested in the causes and effects of For years, people have been using gold-tin in Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Indium Corporation's Product Manager of PCB Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the challenge of

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of

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Avoid the Void®: Voiding in High-Temperature Soldering
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding: Causes and Mitigation
Avoid the Void™ Common Causes of Voiding in Electronics Assembly
Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints
Avoid the Void®: Beyond QFN Voiding
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™
Reducing Voiding in Bottom Terminated Components Using Solder Fortification® Preforms
Avoid the Void™
Fill the Void VII: Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
Avoid the Void™ with Halogen-Free Indium8.9HF Solder Paste
Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials
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Avoid the Void®: Voiding in High-Temperature Soldering

Avoid the Void®: Voiding in High-Temperature Soldering

Gold-Tin eutectic

Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms

Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms

Voiding

Voiding: Causes and Mitigation

Voiding: Causes and Mitigation

This video is for engineers working to overcome

Avoid the Void™ Common Causes of Voiding in Electronics Assembly

Avoid the Void™ Common Causes of Voiding in Electronics Assembly

This video is for anyone interested in the causes and effects of

Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints

Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints

For years, people have been using gold-tin in

Avoid the Void®: Beyond QFN Voiding

Avoid the Void®: Beyond QFN Voiding

Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™

Indium Corporation's Product Manager of PCB

Reducing Voiding in Bottom Terminated Components Using Solder Fortification® Preforms

Reducing Voiding in Bottom Terminated Components Using Solder Fortification® Preforms

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the challenge of

Avoid the Void™

Avoid the Void™

Voiding

Fill the Void VII: Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints

Fill the Void VII: Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints

This is

Avoid the Void™ with Halogen-Free Indium8.9HF Solder Paste

Avoid the Void™ with Halogen-Free Indium8.9HF Solder Paste

Indium Corporation's Product Manager of PCB

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part III of III

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part III of III

This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part II of III

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part II of III

This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part I of III

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part I of III

This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of

2016 SMTAI Fill the Void Presentation Video

2016 SMTAI Fill the Void Presentation Video

Voids